English 

RES 120

SEM controlled broad ion beam milling /etching system

Overview

RESSEM - SEM Controlled Broad Ion Beam Milling/Etching

SEM controlled Broad ION Beam Milling / Etching System

The RES120 is the combination of conventional ion beam preparation and in-situ SEM monitoring for target specific preparation in the nm range.

Key Features

  • Ion beam milling with in-situ SEM observation
  • Full computer control
  • TEM and SEM applications of highest flexibility
  • Variable ion energies and milling angles
  • Load lock system for permanent high vacuum
  • Specimen observation while ion milling through BSE detection
  • Integrated milling recipes
  • Process evaluation through high resolution SEM imaging
  • TEM process auto-termination through STEM imaging

Ion beam milling with in-situ SEM observation

The RES120 features a SEM equipped with a SE (Secondary Electron), a BSE (Back Scattered Electron) and a TE (Transmitted Electron) detector. This combines the advantages of conventional broad ion beam milling with the possibility to visualise and control the milling progress precisely to a specific specimen site.

Full computer control

All parameter settings for the milling process and the SEM system are operated via one touch screen. The ability to program complete milling sequences, store application recipes for various user levels, the semi-automatic SEM operation as well as settings for advanced users enables successful and repeatable sample preparation for all levels of experience. Once the RES120 program is started, the PC controls the entire milling process.

TEM and SEM applications of highest flexibility.

Load lock system for permanent high vacuum

The RES120 includes a load lock system, which is completely decoupled from the stage, avoiding any vibration during operation. The specimen initially mounted onto the specimen holder, is then placed into the load lock system. Once the load lock is evacuated, the specimen holder is transferred to the stage in the main chamber. This system allows save and rapid specimen transfer and exchange, without affecting the vacuum in the process chamber. Once the specimen is loaded, ion milling and/or specimen examination can start immediately

Specimen observation while ion milling through BSE detection

The SEM as observation device enables optimal specimen watching and monitoring of preparation results (resolution approx. 50nm) while ion milling. In this so called ion milling mode, it is possible to thin a specific specimen area in the x-y-plane precisely to a desired depth in z-direction using BSE and/or TE detection. The TE detector is mounted right underneath the specimen and allows very sensitive process termination using STEM imaging. The split screen mode, that allows BSE and TE imaging at the same time, is a very helpful tool particularly during the final thinning procedure.

Integrated milling recipes

The computer controlled RES120 can be programmed to run entire ion milling processes fully automatically. Each individual milling sequence can be programmed and combined to a complete ion milling recipe. These recipes can be stored in an application library and reused for reoccurring preparation tasks. The factory programmed library contains basic milling procedures and can be extended without software limitation.

Process evaluation through high resolution SEM imaging

The process control via regular SEM imaging secures the visualisation of defects and voids without removing and/or destroying structure areas of interest.TEM process auto-termination through STEM imaging