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Leica EM TXP

Target surfacing system

Overview

Target Surfacing System

The Leica EM TXP is a unique target preparation device especially developed for cutting and polishing samples prior to examination by SEM, TEM and LM techniques. It excels with challenging specimens where pinpointing and preparing barely visible targets becomes easy. Before the Leica EM TXP, sawing, milling, grinding and polishing exactly to the target was often a very time-consuming and difficult procedure as points of interest were easily missed and specimens often difficult to handle due to their small size.

With the Leica EM TXP such samples can easily be prepared.

Key Features

  • Target preparation during observation with a stereo microscope
  • Integrated sawing and autopolishing mechanism
  • Automated processing function
  • Accurate location and preparation of microtargets
  • Automatic process control to produce a mirror-like surface quality

Integrated Viewing System
Stereo microscopic target observation during the working process

With the specimen pivot arm the sample can be observed during preparation at an angle between 0° and 60°, directly onto the front face, or 90° to the front face for distance determination witha na eyepiece graticule.

Process Possibilities

Once the sample is clamped into the specimen holder and inserted in the pivot arm, the specimen can be:

- milled
- sawed
- ground
and polished

without removing the sample from the Leica EM TXP and simply changing the tools while observing the process directly through the stereomicroscope.

Look through the Stereo Microscope

and see the area of interest .....

Integrated Automatic Process Control

The Leica EM TXP automatic process control mechanism saves you from time-consuming routine sample preparation:

- with the automatic E-W guiding mechanism
- with the force-regulated feed control
- with the countdown function
and level sensor for the integrated lubricant cooling system